| PART |
Description |
Maker |
| 1FGSXXXX |
Ball Grid Array Socketing System
|
Advanced Interconnections
|
| NP396-500 |
Shrink Ball Grid Array (1.27mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
| NP291-04812-2-AC-14680 NP291-04812-2-G4-BF NP291-0 |
Fine Ball Grid Array (FBGA, 0.75mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
| ETCSP |
the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height.
|
Amkor Technology, Inc.
|
| CHC-CD0865A-01-10R0F CHC-CD0865A-01-10R0G CHC-CD08 |
Ceramic Ball Grid Termination Arrays
|
IRC - a TT electronics Company.
|
| BK32164M102-T |
Multilayer Chip Bead Array Inductors (BK array series)
|
Taiyo Yuden (U.S.A.), Inc
|
| BK32164L680-T |
Multilayer Chip Bead Array Inductors (BK array series)
|
Taiyo Yuden (U.S.A.), Inc
|
| BK32164L181-T |
Multilayer Chip Bead Array Inductors (BK array series)
|
Taiyo Yuden (U.S.A.), I...
|
| BK20104W680-T |
Multilayer Chip Bead Array Inductors (BK array series)
|
Taiyo Yuden (U.S.A.), I...
|
| BK32164S471-T |
Multilayer Chip Bead Array Inductors (BK array series)
|
Taiyo Yuden (U.S.A.), I...
|
| BK20104L330-T |
Multilayer Chip Bead Array Inductors (BK array series)
|
Taiyo Yuden (U.S.A.), I...
|
